Welcome, welcome! Ever wonder what all those numbers and letters on your Samsung memory stick mean? Well, Let's dive in!
Here's a breakdown of the Samsung part numbering system:
Field | Description |
---|---|
M378A2G43CB3-CWE | Example part number |
M | Memory Module |
3 | 3 = DIMM, 4 = SO-DIMM |
78 | 78 = x64 288-pin Unbuffered DIMM, 91 = x72 288-pin Unbuffered ECC DIMM |
A | A = DDR4 (1.2V) |
2G | According to Samsung: Depth, usually 51 (512M), 1G / 1K, 2G / 2K, 4G The K notation is if 8Gbit ICs are used, the G notation otherwise. (I don't understand but this is always the stick's capacity divided by 8) |
4 | 4 = 16 Banks & 1.2V |
3 | Width - 0 = x4, 3 = x8, 4 = x16 |
C | Component Revision |
B | Package, B = Flip Chip FBGA, M = DDP FBGA |
3 | PCB Revision, numeric part (e.g. 2 may mean A2 or B2) |
C | C is commercial temperature rating, I is industrial |
WE | JEDEC speed rating, see table (3200CL22) |
The label does not contain the density directly. However you can figure it out:
Since the Component Revision is C, and the Density works out at 16Gbit, this example is S16C, in the 3200CL22 JEDEC bin.